Skip to main content

How 3D Integration Technologies Enable Advanced Compute Node for Exascale Level High Performance Computing?

D. Dutoit, P. Coudrain, P.-Y. Martinez, P. Vivet, J. Charbonnier, A. Garnier, D. Lattard, S. Cheramy, E. Guthmuller, A. Philippe, Y. Thonnart, F. Clermidy

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
    Length: 00:19:53

More Like This

Recent Advances on Cu-Cu and Hybrid Bonding for Advanced Packaging Platforms and Applications (Video)
26 Jun 2024

Recent Advances on Cu-Cu and Hybrid Bonding for Advanced Packaging Platforms and Applications (Video)

1.00 pdh
  • EDS
    Members: Free
    IEEE Members: $15.00
    Non-members: $20.00
Manufacturing Webinar Series - Smart Manufacturing System Engineering for Semiconductor Factories (Video)
26 Jun 2024

Manufacturing Webinar Series - Smart Manufacturing System Engineering for Semiconductor Factories (Video)

1.00 pdh
  • EDS
    Members: Free
    IEEE Members: $15.00
    Non-members: $20.00
Quantum Webinar Series - Increasing the complexity of semiconductor quantum devices (Video)
19 Jun 2024

Quantum Webinar Series - Increasing the complexity of semiconductor quantum devices (Video)

1.00 pdh
  • EDS
    Members: Free
    IEEE Members: $15.00
    Non-members: $20.00