Skip to main content

wang kexin

A Stacked Embedded DRAM Array for LPDDR4/4V using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic to Memory Interface
15 Dec 2020

A Stacked Embedded DRAM Array for LPDDR4/4V using Hybrid Bonding 3D Integration with 34GB/s/1Gb 0.88pJ/b Logic to Memory Interface

  • EDS
    Members: $5.00
    IEEE Members: $10.00
    Non-members: $20.00
Subscribe to wang kexin