Low Temperature and Ion Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo Sensor Circuits
Hoonhee Han, Rino Choi, Seong-Ook Jung, Sung Woo Chung, Byung Jin Cho, S.C. Song, Changhwan Choi
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Members: $5.00EDS
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Non-members: $20.00Length: 00:20:12
15 Dec 2020
