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Staggered Metallization with Air Gaps for Independently Tuned Interconnect Resistance and Capacitance

K.L. Lin, M. Anders, R. Bristol, M. Christenson, G. Elbaz, B. Holybee, H. Kaul, M. Kobrinsky, R. Krishnamurthy, M. Reshotko, H.J. Yoo

DOI
10.17023/ks2w-z118
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