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Graphene on cubic silicon carbide: a platform on silicon for More-Than-Moore integrated technologies by Prof Francesca Iacopi
02 Sep 2020

Graphene on cubic silicon carbide: a platform on silicon for More-Than-Moore integrated technologies by Prof Francesca Iacopi

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Introducing Layered Dieletrics in solid-state microelectronic devices
19 Aug 2020

Introducing Layered Dieletrics in solid-state microelectronic devices

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Materials and Device Technologies for Quantum Information Sciences
05 Aug 2020

Materials and Device Technologies for Quantum Information Sciences

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Heterogeneous Integration - why is it becoming such a big deal and how does it affect electron device development
22 Jul 2020

Heterogeneous Integration - why is it becoming such a big deal and how does it affect electron device development

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Ga2O3 Power Devices and How They Stand up to GaN and SiC
08 Jul 2020

Ga2O3 Power Devices and How They Stand up to GaN and SiC

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Atomristors: 2D Non-volatile Memory Devices and RF/5G Switches
25 Jun 2020

Atomristors: 2D Non-volatile Memory Devices and RF/5G Switches

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Executive Sessions:EG1 Heterogeneous Integration (2)
18 Jun 2020

Executive Sessions:EG1 Heterogeneous Integration (2)

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Joint Plenary (II)
17 Jun 2020

Joint Plenary (II)

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Technology Sessions: BEOL Compatible Dual-Gate Ultra Thin-Body W-Doped Indium-Oxide Transistor with IoN = 370 uA/um, SS=73mV/dec and IoN/IOFF ratio>4x10^9
16 Jun 2020

Technology Sessions: BEOL Compatible Dual-Gate Ultra Thin-Body W-Doped Indium-Oxide Transistor with IoN = 370 uA/um, SS=73mV/dec and IoN/IOFF ratio>4x10^9

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Joint Sessions: TeraPHHY: An O-Band WDM Electro-Optic Platform for Low Power, Terabit/s Optical I/O
16 Jun 2020

Joint Sessions: TeraPHHY: An O-Band WDM Electro-Optic Platform for Low Power, Terabit/s Optical I/O

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Technology Sessions: SoC Compatible 1T1C FeRAM Memory Array Based on Ferroelectric Hf0.5 Zr0.5 02
16 Jun 2020

Technology Sessions: SoC Compatible 1T1C FeRAM Memory Array Based on Ferroelectric Hf0.5 Zr0.5 02

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Technology Sessions: Low Temperature SoIC^TM Bonding and Stacking Technology for 12/16-Hi High Bandwidth Memory (HBM)
16 Jun 2020

Technology Sessions: Low Temperature SoIC^TM Bonding and Stacking Technology for 12/16-Hi High Bandwidth Memory (HBM)

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