The Demonstration of Carbon Nano Tubes (CNTs) as a Promising High Aspect Ratio (>25) Through Silicon Vias (TSVs) Material for the Vertical Connection in the High Dense 3DICs
P.-Y. Lu, C.-M.Yen, S.-Y. Chang, Y.J. Feng, C. Lien, C.-W. Hu, C.-W. Yao, M.-H. Lee, M.-H. Liao
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15 Dec 2020
